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ADS8688 Datasheet(PDF) 5 Page - Texas Instruments |
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ADS8688 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 80 page  ADS8684A, ADS8688A www.ti.com SBAS680 – JULY 2015 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AIN_nP, AIN_nGND to GND(2) –20 20 V AIN_nP, AIN_nGND to GND(3) –11 11 V AUX_GND to GND –0.3 0.3 V AUX_IN to GND –0.3 AVDD + 0.3 V AVDD to GND or DVDD to GND –0.3 7 V REFCAP to REFGND or REFIO to REFGND –0.3 5.7 V GND to REFGND –0.3 0.3 V Digital input pins to GND –0.3 DVDD + 0.3 V Digital output pins to GND –0.3 DVDD + 0.3 V Operating temperature, TA –40 125 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) AVDD = 5 V or offers a low impedance of < 30 k Ω. (3) AVDD = floating with an impedance > 30 k Ω. 7.2 ESD Ratings VALUE UNIT Analog input pins ±4000 (AIN_nP; AIN_nGND) Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) Electrostatic V(ESD) V discharge All other pins ±2000 Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT AVDD Analog supply voltage 4.75 5 5.25 V DVDD Digital supply voltage 1.65 3.3 AVDD V 7.4 Thermal Information ADS8684A, ADS8688A THERMAL METRIC(1) UNIT DBT (TSSOP) 38 PINS RθJA Junction-to-ambient thermal resistance 68.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 19.9 °C/W RθJB Junction-to-board thermal resistance 30.4 °C/W ψJT Junction-to-top characterization parameter 1.3 °C/W ψJB Junction-to-board characterization parameter 29.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance NA °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ADS8684A ADS8688A |
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