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DS90UH940TNKDRQ1 Datasheet(PDF) 9 Page - Texas Instruments |
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DS90UH940TNKDRQ1 Datasheet(HTML) 9 Page - Texas Instruments |
9 / 87 page 9 DS90UH940-Q1 www.ti.com SNLS478A – NOVEMBER 2014 – REVISED JANUARY 2016 Product Folder Links: DS90UH940-Q1 Submit Documentation Feedback Copyright © 2014–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) For soldering specifications, see product folder at www.ti.com and SNOA549 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) PARAMETER MIN MAX UNIT VDD33 Supply voltage –0.3 4.0 V VDD12 Supply voltage -0.3 1.8 V VDDIO Supply voltage –0.3 4.0 V LVCMOS I/O voltage –0.3 VDDIO + 0.3 V FPD-Link III input voltage –0.3 2.75 V TJ Junction temperature 150 °C Tstg Storage temperature range -65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings—JEDEC VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±8000 V Charged-device model (CDM), per AEC Q100-011 ±1250 7.3 ESD Ratings—IEC and ISO VALUE UNIT V(ESD) Electrostatic discharge RD = 330 Ω, CS = 150 pF IEC, powered-up only contact discharge (RIN0+, RIN0-, RIN1+, RIN1-) ±8000 V IEC, powered-up only air-gap discharge (RIN0+, RIN0-, RIN1+, RIN1-) ±15000 RD = 330 Ω, CS = 150 and 330 pF ISO10605 contact discharge (RIN0+, RIN0-, RIN1+, RIN1-) ±8000 V ISO10605 air-gap discharge (RIN0+, RIN0-, RIN1+, RIN1-) ±15000 RD = 2 kΩ, CS = 150 and 330 pF ISO10605 contact discharge (RIN0+, RIN0-, RIN1+, RIN1-) ±8000 V ISO10605 air-gap discharge (RIN0+, RIN0-, RIN1+, RIN1-) ±15000 7.4 Recommended Operating Conditions MIN NOM MAX UNIT Supply Voltage (VDD33) 3.0 3.3 3.6 V Supply Voltage (VDD18) 1.71 1.8 1.89 V Supply Voltage (VDD12) 1.14 1.2 1.26 V Operating Free Air Temperature (TA) −40 25 105 °C Pixel Clock Frequency (Single Link) 25 96 MHz Pixel Clock Frequency (Dual Link) 50 170 MHz Supply Noise -- VDD33 (DC-50MHz) 100 mVP-P Supply Noise -- VDD18 (DC-50MHz) 50 mVP-P Supply Noise -- VDD12 (DC-50MHz) 25 mVP-P |
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