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HD3SS3212IRKSR Datasheet(PDF) 1 Page - Texas Instruments |
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HD3SS3212IRKSR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 26 page GND A0p 3 4 5 6 2 B0n C0n C0p B0p 18 17 16 15 19 SEL 20 OEn 1 A0n VCC B1n C1n C1p B1p A1p A1n 7 8 9 14 13 12 Product Folder Sample & Buy Technical Documents Tools & Software Support & Community HD3SS3212, HD3SS3212I SLASE74C – MAY 2015 – REVISED JANUARY 2016 HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux 1 Features 3 Description The HD3SS3212 is a high-speed bidirectional 1 • Provides MUX/DEMUX Solution for USB Type- passive switch in mux or demux configurations suited C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 for USB Type-C™ application supporting USB 3.1 Data Rates Gen 1 and Gen 2 data rates. Based on control pin • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, SEL, the device provides switching on differential and PCIE Gen II, III channels between Port B or Port C to Port A. • Operates up to 10 Gbps The HD3SS3212 is a generic analog differential • Wide –3-dB Differential BW of over 8 GHz passive switch that can work for any high-speed interface applications requiring a common mode • Excellent Dynamic Characteristics (at 5 GHz) voltage range of 0 to 2 V and differential signaling – Crosstalk = –32 dB with differential amplitude up to 1800 mVpp. It – Off Isolation = –19 dB employs adaptive tracking that ensures the channel remains unchanged for the entire common mode – Insertion Loss = –1.6 dB voltage range. – Return Loss = –12 dB Excellent dynamic characteristics of the device allow • Bidirectional "Mux/De-Mux" Differential Switch high-speed switching with minimum attenuation to the • Supports Common Mode Voltage 0 to 2 V signal eye diagram with very little added jitter. It • Single Supply Voltage VCC of 3.3 V ±10% consumes <2 mW of power when operational and has a shutdown mode exercisable by OEn pin • Commercial Temperature Range of 0°C to 70°C resulting <20 µW. (HD3SS3212RKS) • Industrial Temperature Range of –40°C to 85°C Device Information(1) (HD3SS3212IRKS) PART NUMBER PACKAGE BODY SIZE (NOM) HD3SS3212 2.50 mm × 4.50 mm × 2 Applications VQFN (20) 0.5-mm pitch HD3SS3212I • USB Type-C™ Ecosystem (1) For all available packages, see the orderable addendum at • Desktop and Notebook PCs the end of the data sheet. • Server/Storage Area Networks • PCI Express Backplanes • Shared I/O Ports • FPDLinkII and FPDLinkIII Switching SPACE Simplified Schematic Pinout 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. |
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