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HD3SS3212IRKSR Datasheet(PDF) 1 Page - Texas Instruments

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Part # HD3SS3212IRKSR
Description  Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

HD3SS3212IRKSR Datasheet(HTML) 1 Page - Texas Instruments

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GND
A0p 3
4
5
6
2
B0n
C0n
C0p
B0p
18
17
16
15
19
SEL
20
OEn
1
A0n
VCC
B1n
C1n
C1p
B1p
A1p
A1n
7
8
9
14
13
12
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HD3SS3212, HD3SS3212I
SLASE74C – MAY 2015 – REVISED JANUARY 2016
HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux
1 Features
3 Description
The
HD3SS3212
is
a
high-speed
bidirectional
1
Provides MUX/DEMUX Solution for USB Type-
passive switch in mux or demux configurations suited
C™ Ecosystem for USB 3.1 Gen 1 and Gen 2
for USB Type-C™ application supporting USB 3.1
Data Rates
Gen 1 and Gen 2 data rates. Based on control pin
Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS,
SEL, the device provides switching on differential
and PCIE Gen II, III
channels between Port B or Port C to Port A.
Operates up to 10 Gbps
The HD3SS3212 is a generic analog differential
Wide –3-dB Differential BW of over 8 GHz
passive switch that can work for any high-speed
interface applications requiring a common mode
Excellent Dynamic Characteristics (at 5 GHz)
voltage range of 0 to 2 V and differential signaling
Crosstalk = –32 dB
with differential amplitude up to 1800 mVpp. It
Off Isolation = –19 dB
employs adaptive tracking that ensures the channel
remains unchanged for the entire common mode
Insertion Loss = –1.6 dB
voltage range.
Return Loss = –12 dB
Excellent dynamic characteristics of the device allow
Bidirectional "Mux/De-Mux" Differential Switch
high-speed switching with minimum attenuation to the
Supports Common Mode Voltage 0 to 2 V
signal eye diagram with very little added jitter. It
Single Supply Voltage VCC of 3.3 V ±10%
consumes <2 mW of power when operational and
has a shutdown mode exercisable by OEn pin
Commercial Temperature Range of 0°C to 70°C
resulting <20 µW.
(HD3SS3212RKS)
Industrial Temperature Range of –40°C to 85°C
Device Information(1)
(HD3SS3212IRKS)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
HD3SS3212
2.50 mm × 4.50 mm ×
2 Applications
VQFN (20)
0.5-mm pitch
HD3SS3212I
USB Type-C™ Ecosystem
(1) For all available packages, see the orderable addendum at
Desktop and Notebook PCs
the end of the data sheet.
Server/Storage Area Networks
PCI Express Backplanes
Shared I/O Ports
FPDLinkII and FPDLinkIII Switching
SPACE
Simplified Schematic
Pinout
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.


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