P82B96

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SCPS144C – MAY 2006 – REVISED MAY 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage on VCC pin

–0.3

18

V

Sx or Sy (SDA or SCL)

–0.3

18

Voltage on buffered input

V

Rx or Ry

–0.3

18

Sx or Sy (SDA or SCL)

–0.3

18

Voltage on buffered output

V

Tx or Ty

–0.3

18

Sx or Sy

250

Continuous output current

mA

Tx or Ty

250

Continuous current through VCC or GND

250

mA

Operating free-air temperature

–40

85

°C

Storage temperature

–55

125

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 ESD Ratings

VALUE

UNIT

±3500

Charged-Device Model (CDM), per JEDEC specification JESD22-

±1000

Electrostatic discharge

V

Machine Model (MM), per JEDEC specification JESD22-A115-A

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

MAX

UNIT

Supply voltage

2

15

V

Sx, Sy

3

Low-level output current

mA

Tx, Ty

30

Sx, Sy

15

Maximum input/output voltage level

V

Tx, Ty

15

Low-level input voltage difference

Sx, Sy

0.4

V

Operating free-air temperature

–40

85

°C

7.4 Thermal Information

P82B96

D (SOIC)

DGK (VSSOP)

P (PDIP)

PW (TSSOP)

UNIT

8 PINS

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

109.1

174.3

53.5

173.5

°C/W

61.6

63

44.4

57.6

°C/W

Junction-to-board thermal resistance

48.6

94.2

30.6

101.8

°C/W

Junction-to-top characterization parameter

19.6

8.1

22.9

5.3

°C/W

Junction-to-board characterization parameter

48.2

92.8

30.5

100.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

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