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SN75DP149RSBR Datasheet(PDF) 7 Page - Texas Instruments |
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SN75DP149RSBR Datasheet(HTML) 7 Page - Texas Instruments |
7 / 52 page SN65DP149, SN75DP149 www.ti.com SLLSEL2A – SEPTEMBER 2015 – REVISED DECEMBER 2015 7.4 Thermal Information over operating free-air temperature range (unless otherwise noted) SNx5DP149 THERMAL METRIC(1) RSB (WQFN) UNIT 40 PINS RθJA Junction-to-ambient thermal resistance 37.3 °C/W RθJB Junction-to-board thermal resistance (High-K board(2)) 9.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance (High-K board(2)) 23.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.2 °C/W ψJT Junction-to-top characterization parameter 0.3 °C/W ψJB Junction-to-case (bottom) thermal resistance 3.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Test conditions for ΨJB and ΨJT are clarified in TI document SPRA953, Semiconductor and IC Package Thermal Metrics. Copyright © 2015, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: SN65DP149 SN75DP149 |
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