382

382

Knob Operating Type Potentiometers / Soldering Conditions

No. of reflows

No. of solders

No. of solders

1. When using an infrared reflow oven, solder may sometimes not be applied. Be sure to use a hot air reflow oven or a type that

uses infrared rays in combination with hot air.

2. The temperatures given above are the maximum temperatures at the terminals of the potentiometer when employing a hot air

reflow method. The temperature of the PC board and the surface temperature of the potentiometer may vary greatly depending

on the PC board material, its size and thickness. Ensure that the surface temperature of the potentiometer does not rise to

250℃ or greater.

3. Conditions vary to some extent depending on the type of reflow bath used. Be sure to give due consideration to this prior to use.

Notes

1 time

1 time

Soldering temperature

Soldering time

Soldering surface temperature

Heating time

RK08H1□1, RK08H1□2, RK10J, RK14J

RK14J1□A

Series

Series

350℃ max.

80 to 120℃

70±30s

3s max.

260℃±5℃

4±1s

Tip temperature

Preheating

Soldering time

Dip soldering

Reference for Manual Soldering

Reference for Dip Soldering

RK08H1□3, RK10J1□R,

RK14J1□R

250℃

3s

4 min.

2 time max.

200℃

2 min.

40s

150℃

150℃

Series

Example of Reflow Soldering Condition

300

200

100

A

B

C

Time (s)

G max.

F max.

H max.

E max.

Room

temperature

Pre-heating

D

Temperature profile

D

A

B

C

E

G

F

H