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BZT52C6V2 Datasheet(PDF) 1 Page - Shanghai Shunye Electronics Co.,Ltd. |
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BZT52C6V2 Datasheet(HTML) 1 Page - Shanghai Shunye Electronics Co.,Ltd. |
1 / 4 page Surface mount zener diode BZT52C2V4-BZT52C51 FEATURES Planar die construction. Pb Lead-free 500mW power dissipation on ceramic PCB. General purpose, medium current. Ideally suited for automated assembly processes. APPLICATIONS Zener diode. Ultra-small surface mount package. SOD-123 ORDERING INFORMATION Type No. Marking Package Code BZT52C2V4-BZT52C51 See table 2 SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF=10mA VF 0.9 V Power Dissipation Pd 500 mW Thermal resistance,junction to ambient air RθjA 305 ℃/W Junction temperature Tj 150 ℃ Storage temperature range Tstg -65-150 ℃ Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 2. Short duration test pulse used to minimize self-heating effect. 3. When provided, otherwise, parts are provided with date code only, and type number identifications appears on reel only. 4. f = 1KHz www.shunyegroup.com.cn |
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