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CLX32 Datasheet(PDF) 2 Page - Infineon Technologies AG |
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CLX32 Datasheet(HTML) 2 Page - Infineon Technologies AG |
2 / 9 page CLX32 Semiconductor Group 2 of 10 Draft D, September 99 Maximum Ratings Parameter Symbol Values Unit Drain-source voltage VDS 11 V Drain-gate voltage VDG 13 V Gate-source voltage VGS - 6 V Drain current ID 1400 mA Gate forward current IG 10 mA Compression Level Operation Range 1 1) PC 1.5 at VDS ≤ 8 V 2.5 at VDS ≤ 7 V 3.5 at VDS ≤ 6 V dB Compression Level Operation Range 2 2) PC 3.5 at VDS ≤ 6 V dB Compression Level Operation Range 3 3) PC tbd. dB Junction temperature TJ 175 °C Storage temperature range Tstg - 65...+ 175 °C Total power dissipation 4) Ptot 5.4 W Soldering temperature 5) Tsol 230 °C Thermal Resistance Junction-soldering point Rth JS ≤ 25 K/W Notes.: 1) Operation Range 1: 270 mA ≤ ID ≤ 540 mA 2) Operation Range 2: ID > 540 mA 3) Operation Range 3: ID < 270 mA 4) At TS = + 40 °C. For TS > + 40 °C derating is required. 5) During 15 sec. maximum. The same terminal shall not be resoldered until 3 minutes have elapsed. |
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