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STPTIC-82F1M6 Datasheet(PDF) 10 Page - STMicroelectronics |
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STPTIC-82F1M6 Datasheet(HTML) 10 Page - STMicroelectronics |
10 / 13 page Reflow profile STPTIC 10/13 DocID023772 Rev 4 4 Reflow profile Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting Note: Minimize air convection currents in the reflow oven to avoid component movement. 250 0 50 100 150 200 240 210 180 150 120 90 60 30 300 270 -6°C/s 240-245 °C 2 - 3 °C/s Temperature (°C) -2 °C/s -3 °C/s Time (s) 0.9 °C/s 60 sec (90 max) Table 5. Recommended values for soldering reflow Profile Value Typical Max. Temperature gradient in preheat (T = 70-180 °C) 0.9 °C/s 3 °C/s Temperature gradient (T = 200-225 °C) 2 °C/s 3 °C/s Peak temperature in reflow 240-245 °C 260 °C Time above 220 °C 60 s 90 s Temperature gradient in cooling -2 to -3 °C/s -6 °C/s Time from 50 to 220 °C 160 to 220 s |
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