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HYB18L256160BF-75 Datasheet(PDF) 11 Page - Infineon Technologies AG |
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HYB18L256160BF-75 Datasheet(HTML) 11 Page - Infineon Technologies AG |
11 / 49 page Data Sheet 11 V1.4, 2004-04-30 HY[B/E]18L256160B[C/F]-7.5 256-Mbit Mobile-RAM Functional Description 2 Functional Description The 256-Mbit Mobile-RAM is a high-speed CMOS, dynamic random-access memory containing 268,435,456 bits. It is internally configured as a quad-bank DRAM. READ and WRITE accesses to the Mobile-RAM are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. Accesses begin with the registration of an ACTIVE command, followed by a READ or WRITE command. The address bits registered coincident with the ACTIVE command are used to select the bank and row to be accessed (BA0, BA1 select the banks, A0 - A12 select the row). The address bits registered coincident with the READ or WRITE command are used to select the starting column location for the burst access. Prior to normal operation, the Mobile-RAM must be initialized. The following sections provide detailed information covering device initialization, register definition, command description and device operation. 2.1 Power On and Initialization The Mobile-RAM must be powered up and initialized in a predefined manner (see Figure 3). Operational procedures other than those specified may result in undefined operation. Figure 3 Power-Up Sequence and Mode Register Sets Power-up: VDD and CK stable Load Mode Register Load Ext. Mode Register = Don't Care BA0=L BA1=H t RFC t RFC t MRD t MRD t RP 200µs t CK All Banks DQ (High-Z) DQM BA0,BA1 NOP BA A10 CODE NOP RA CODE Address CODE NOP RA CODE Command PRE ARF ARF MRS NOP NOP ACT MRS CLK BA0=L BA1=L (H Level) VDD VDDQ CKE |
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