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ISO3086TDWR Datasheet(PDF) 4 Page - Texas Instruments |
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ISO3086TDWR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page ISO3086T SLLSE27D – JANUARY 2011 – REVISED OCTOBER 2015 www.ti.com 6.2 ESD Ratings VALUE UNIT Bus pins and GND1 ±6000 Human body model (HBM), per ANSI/ESDA/JEDEC JS- Bus pins and GND2 ±11000 001(1) Electrostatic V(ESD) All pins ±4000 V discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 Machine model (MM), ANSI/ESDS5.2-1996 ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN NOM MAX UNIT 3.3 V Operation 3 3.3 3.6 VCC1 Logic-side supply voltage V 5 V Operation 4.5 5 5.5 VCC2 Bus-side supply voltage 4.5 5 5.5 V VI or VIC Voltage at any bus terminal (separately or common-mode) –7 12 V RE 2 VCC1 VIH High-level input voltage V D, DE 0.7 VCC1 RE 0 0.8 VIL Low-level input voltage V D, DE 0.3 VCC1 A with respect to B –12 12 VID Differential input voltage V Dynamic See Figure 16 RL Differential load resistance 54 60 Ω Driver –60 60 IO Output Current mA Receiver –8 8 TA Ambient temperature –40 85 °C TJ Operating junction temperature –40 150 °C 1 / tUI Signaling Rate 20 Mbps 6.4 Thermal Information ISO3086T THERMAL METRIC(1) DW (SOIC) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 80.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 43.8 °C/W RθJB Junction-to-board thermal resistance 49.7 °C/W ψJT Junction-to-top characterization parameter 13.8 °C/W ψJB Junction-to-board characterization parameter 41.4 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.5 Power Rating over operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VALUE UNIT VCC1 = VCC2 = 5.5V, TJ = 150°C, RL = 54Ω, CL = 50pF (Driver), CL = 15pF (Receiver), PD Maximum device power dissipation 490 mW Input a 10 MHz 50% duty cycle square wave to Driver and Receiver 4 Submit Documentation Feedback Copyright © 2011–2015, Texas Instruments Incorporated Product Folder Links: ISO3086T |
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