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ISO3082DW Datasheet(PDF) 5 Page - Texas Instruments |
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ISO3082DW Datasheet(HTML) 5 Page - Texas Instruments |
5 / 31 page ISO3080, ISO3082, ISO3086, ISO3088 www.ti.com SLOS581H – MAY 2008 – REVISED DECEMBER 2015 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT VCC Input supply voltage, (2) VCC1, VCC2 –0.3 6 V VO Voltage at any bus I/O terminal –9 14 V VIT Voltage input, transient pulse, A, B, Y, and Z (through 100 Ω, see Figure 20) –50 50 V VI Voltage input at any D, DE or RE terminal –0.5 7 V IO Receiver output current ±10 mA TJ Maximum junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values except differential I/O bus voltages are with respect to network ground terminal and are peak voltage values 7.2 ESD Ratings VALUE UNIT Bus pins and GND1 ±6000 Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all Bus pins and GND2 ±12000 V pins(1) V(ESD) Electrostatic discharge All pins ±4000 Charged device model (CDM), per JEDEC specification JESD22- All pins ±1000 V C101, all pins(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions MIN TYP MAX UNIT VCC1 Logic-side supply voltage (1) 3.15 5.5 V VCC2 Bus-side supply voltage(1) 4.5 5 5.5 V VOC Voltage at either bus I/O terminal A, B –7 12 V VIH High-level input voltage 2 VCC D, DE, RE V VIL Low-level input voltage 0 0.8 A with respect to B –12 12 VID Differential input voltage V Dynamic (ISO3086) see Figure 9 RL Differential input resistance 54 60 Ω Driver –60 60 IO Output current mA Receiver –8 8 TA Ambient temperature –40 85 °C (1) For 5-V operation, VCC1 or VCC2 is specified from 4.5 V to 5.5 V. For 3.3-V operation, VCC1 is specified from 3.15 V to 3.6 V. 7.4 Thermal Information ISO308x THERMAL METRIC(1) DW UNIT 16 PINS 168 Low-K thermal resistance(2) RθJA Junction-to-ambient thermal resistance °C/W High-K thermal resistance 79.6 RθJC(top) Junction-to-case (top) thermal resistance 39.7 °C/W RθJB Junction-to-board thermal resistance 44.7 °C/W ψJT Junction-to-top characterization parameter 11.8 °C/W ψJB Junction-to-board characterization parameter 44.0 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Tested in accordance with the Low-K or High-K thermal metric definitions of EIA/JESD51-3 for leaded surface mount packages. Copyright © 2008–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: ISO3080 ISO3082 ISO3086 ISO3088 |
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