156

156

Soldering time

Example of Reflow Soldering Condition

1. Heating method: Double heating method with infrared heater.

2. Temperature measurement: Thermocouple φ0.1 to 0.2 CA（K）or CC（T）at soldering portion（copper foil surface）.

　 A heat resisting tape should be used for fixed measurement.

3. Temperature profile

300

200

100

A max.

B

D

E

C

Time (s)

F max.

Room

temperature

Pre-heating

1.The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the

PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc.

The above-stated conditions shall also apply to switch surface temperatures.

2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended.

Notes

300

200

100

A max.

B

C

Time (s)

25s max.

E max.

D max.

Pre-heating

F

Room

temperature

SRBQ

—

250

200

—

150±5

80 to 100

D（s）

Series（Reflow type）

A（℃）

3s max.

B（℃）

C（℃）

E（s）

F（s）

SRBD

F（s）

Series（Reflow type）

260

230

150

120

40

180

A（℃）

3s max.

B（℃）

C（s）

D（℃）

E（℃）

SRBQ（Reflow type）

SRBQ, SRBM, SRBV, SRRM, SRRN

3s max.

Soldering temperature Duration of immersion

Preheating time

Series

60s max.

3+1/0s

260±5℃

5s max.

260±5℃

10±1s

260±5℃

5±1s

350±5℃

350±10℃

Soldering temperature

Dip soldering

Reference for Hand Soldering

Reference for Dip Soldering

(For PC board terminal types)

Rotary Switches Soldering Conditions

SRBQ

SRBV, SRRM, SRRN

SRBM

Series

—

Preheating temperature

100℃ max.

—

Items