Package information

STTH1R04-Y

6/10

DocID024449 Rev 1

2

Package information

•

Epoxy meets UL94, V0

•

Lead-free package

•

Cooling method: by conduction (C)

In order to meet environmental requirements, ST offers these devices in different grades of

specifications, grade definitions and product status are available at: www.st.com.

Figure 14. SMB dimension definitions

E

C

L

E1

D

A1

A2

b