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STTH1R04AY Datasheet(PDF) 6 Page - STMicroelectronics |
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STTH1R04AY Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 10 page Package information STTH1R04-Y 6/10 DocID024449 Rev 1 2 Package information • Epoxy meets UL94, V0 • Lead-free package • Cooling method: by conduction (C) In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 14. SMB dimension definitions E C L E1 D A1 A2 b |
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