5

CGHV31500F Rev 1.0 - PRELIMINARY

Cree, Inc.

4600 Silicon Drive

Durham, North Carolina, USA 27703

USA Tel: +1.919.313.5300

Fax: +1.919.869.2733

www.cree.com/rf

Copyright © 2015 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are

registered trademarks of Cree, Inc.

CGHV31500F-AMP Application Circuit Bill of Materials

Designator

Description

Qty

R1

RES, 511, OHM, +/- 1%, 1/16W, 0603

1

R2

RES, 5.1, OHM, +/- 1%, 1/16W, 0603

1

C1

CAP, 6.8pF, +/-0.25%, 250V, 0603

1

C2, C7, C8

CAP, 10.0pF, +/-1%, 250V, 0805

3

C3

CAP, 10.0pF, +/-5%, 250V, 0603

1

C4, C9

CAP, 470pF, 5%, 100V, 0603, X

2

C5

CAP, 33000 pF, 0805, 100V, X7R

1

C6

CAP, 10uF 16V TANTALUM

1

C10

CAP, 1.0uF, 100V, 10%, X7R, 1210

1

C11

CAP, 33uF, 20%, G CASE

1

C12

CAP, 3300uF, +/-20%, 100V, ELECTROLYTIC

1

J1,J2

CONN, SMA, PANEL MOUNT JACK, FL

2

J3

HEADER, RT>PLZ, 0.1CEN LK 9POS

1

J4

CONNECTOR; SMB, Straight, JACK, SMD

1

W1

CABLE, 18 AWG, 4.2

1

-

PCB, RO4350, 2.5 X 4.0 X 0.030

1

Q1

CGHV31500F

1

CGHV31500F Power Dissipation De-rating Curve

Maximum Case Temperature (°C)

Note 1. Area exceeds Maximum Case Temperature (See Page 2).

200

250

300

350

400

CGHV31500F Transient Power Dissipation De-Rating Curve

0

50

100

150

0

25

50

75

100

125

150

175

200

225

250

Maximum Case Temperature (°C)

500 us 10 %

100 us 10 %

Note 1