DRV8835

SLVSB18E – MARCH 2012 – REVISED DECEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Power supply voltage, VM

–0.3

12

V

Power supply voltage, VCC

–0.3

7

V

Digital input pin voltage

–0.5

VCC + 0.5

V

Peak motor drive output current

Internally limited

A

–1.5

1.5

A

Operating junction temperature

–40

150

°C

Storage temperature

–60

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

(3)

Power dissipation and thermal limits must be observed.

6.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic discharge

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Device power supply voltage

2

7

V

Motor power supply voltage

0

11

V

Logic level input voltage

0

V

0

1.5

A

Externally applied PWM frequency

0

250

kHz

(1)

Power dissipation and thermal limits must be observed.

6.4 Thermal Information

DRV8835

DSS (WSON)

UNIT

12 PINS

Junction-to-ambient thermal resistance

50.4

°C/W

Junction-to-case (top) thermal resistance

58

°C/W

Junction-to-board thermal resistance

19.9

°C/W

Junction-to-top characterization parameter

0.9

°C/W

Junction-to-board characterization parameter

20

°C/W

Junction-to-case (bottom) thermal resistance

6.9

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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