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DRV8835 Datasheet(PDF) 4 Page - Texas Instruments |
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DRV8835 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 24 page DRV8835 SLVSB18E – MARCH 2012 – REVISED DECEMBER 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings (1) (2) MIN MAX UNIT Power supply voltage, VM –0.3 12 V Power supply voltage, VCC –0.3 7 V Digital input pin voltage –0.5 VCC + 0.5 V Peak motor drive output current Internally limited A Continuous motor drive output current per H-bridge(3) –1.5 1.5 A TJ Operating junction temperature –40 150 °C Tstg Storage temperature –60 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. (3) Power dissipation and thermal limits must be observed. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TA = 25°C (unless otherwise noted) MIN NOM MAX UNIT VCC Device power supply voltage 2 7 V VM Motor power supply voltage 0 11 V VIN Logic level input voltage 0 VCC V IOUT H-bridge output current(1) 0 1.5 A ƒPWM Externally applied PWM frequency 0 250 kHz (1) Power dissipation and thermal limits must be observed. 6.4 Thermal Information DRV8835 THERMAL METRIC(1) DSS (WSON) UNIT 12 PINS RθJA Junction-to-ambient thermal resistance 50.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58 °C/W RθJB Junction-to-board thermal resistance 19.9 °C/W ψJT Junction-to-top characterization parameter 0.9 °C/W ψJB Junction-to-board characterization parameter 20 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.9 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: DRV8835 |
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