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RCLAMP0564P Datasheet(PDF) 5 Page - Semtech Corporation

Part # RCLAMP0564P
Description  Femto Farad RailClamp 4-Line, 170fF ESD Protection
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Manufacturer  SEMTECH [Semtech Corporation]
Direct Link  http://www.semtech.com
Logo SEMTECH - Semtech Corporation

RCLAMP0564P Datasheet(HTML) 5 Page - Semtech Corporation

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RClamp0564P
Final Datasheet
Rev 3.0
July 22, 2015
www.semtech.com
5
Semtech
Applications Information
Assembly Guidelines
Thesmallsizeofthisdevicemeansthatsomecaremust
betakenduringthemountingprocesstoinsurereliable
solderjoints.ThefigureattherightdetailsSemtech’s
recommendedmountingpattern.Recommended
assemblyguidelinesareshowninTable1.Notethat
theseareonlyrecommendationsandshouldserveonly
asastartingpointfordesignsincetherearemanyfactors
thataffecttheassemblyprocess.Exactmanufacturing
parameterswillrequiresomeexperimentationtogetthe
desiredsolderapplication.Semtech’srecommended
mountingpatternisbasedonthefollowingdesign
guidelines:
Land Pattern
TherecommendedlandpatternfollowsIPCstandardsandis
designedformaximumsoldercoverage.Detaileddimensions
areshownelsewhereinthisdocument.
Solder Stencil
Stencildesignisoneofthekeyfactorswhichwilldetermine
thevolumeofsolderpastewhichisdepositedontotheland
pad.Thearearatioofthestencilaperturewilldeterminehow
wellthestencilwillprint.Thearearatiotakesintoaccountthe
apertureshape,aperturesize,andstencilthickness.Anarea
ratioof0.70–0.75ispreferredforthesubjectpackage.The
arearatioofarectangularapertureisgivenas:
AreaRatio=(L*W)/(2*(L+W)*T)
Where:
L=ApertureLength
W=ApertureWidth
T=StencilThickness
Semtechrecommendsastencilthicknessof0.100mmfor
thisdevice.Thestencilshouldbelasercutwithelectro-
polishedfinish.Thestencilshouldhaveapositivetaperof
approximately5degrees.Electropolishingandtapering
thewallsresultsinreducedsurfacefrictionandbetterpaste
release.Forsmallpitchcomponents,Semtechrecommends
asquareaperturewithroundedcornersforconsistentsolder
release.Duetothesmallaperturesize,asolderpastewith
Type4orsmallerparticlesarerecommended.
Recommended Mounting Pattern
All Dimensions are in mm.
Component
Land Pad.
Stencil opening
0.200
0.400
0.025
0.650
0.025
0.200
2.000
0.300
1.000
0.800
Table 1 - Recommended Assembly Guidelines
Assembly Parameter
Recommendation
SolderStencilDesign
LaserCut,Electro-Polished
ApertureShape
Rectangularwithrounded
corners
SolderStencilThickness
0.100mm(0.004”)
SolderPasteType
Type4sizesphereorsmaller
SolderReflowProfile
PerJEDECJ-STD-020
PCBSolderpadDesign
Non-SolderMaskDefined
PCBPadFinish
OSPorNiAu


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