V23990-P70X-A

flow90PACK1

V23990-P70X-F-U-01-14

Handling Instruction

Handling Instructions...

… to the PCB

x The module must be fixed to the PCB by clipping into the adequate holes before pin soldering. See

below

x After fixing all pins must be soldered into the PCB.

x During assembly, at a max. module temperature of 25°C, the pins should not be drawn or pushed

more than ±0.2 mm or loaded with a higher force than 35N.

x At a maximum substrate-temperature of 100°C the load of the pin should not exceed ±5N.

x Vibration stress on pins is not allowed

...to the heat sink

x

the heat sink surface must be clean and particle less.

x

the flatness must be < 0.05 mm for 100 mm continuous.

x

the surface roughness should be less than

...to the thermal paste

x

homogenous applying of the thermal conducting paste over the whole module plate with a

thickness of max. 0.05 mm.

x

...to the fastening screws to the heat sink if plain washer is used and optional with a spring lock

washer

Important parameter

screw

M4 DIN 7985

flat washer

DIN 125 or DIN 433

spring washer

DIN 127 or DIN 128

mounting torque

Copyright by Vincotech

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Revision: 1