ADN8834 datasheet(6/27 Pages) AD

Part #	ADN8834

Description	Ultracompact, 1.5 A Thermoelectric Cooler (TEC) Controller

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Manufacturer	AD [Analog Devices]

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ADN8834

Data Sheet

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

PVIN to PGNDL (WLCSP)

−0.3 V to +5.75 V

PVIN to PGNDS (WLCSP)

−0.3 V to +5.75 V

PVINL to PGNDL (LFCSP)

−0.3 V to +5.75 V

PVINS to PGNDS (LFCSP)

−0.3 V to +5.75 V

LDR to PGNDL (WLCSP)

−0.3 V to VPVIN

LDR to PGNDL (LFCSP)

−0.3 V to VPVINL

SW to PGNDS

−0.3 V to +5.75 V

SFB to AGND

−0.3 V to VVDD

AGND to PGNDL

−0.3 V to +0.3 V

AGND to PGNDS

−0.3 V to +0.3 V

VLIM/SD to AGND

−0.3 V to VVDD

ILIM to AGND

−0.3 V to VVDD

VREF to AGND

−0.3 V to +3 V

VDD to AGND

−0.3 V to +5.75 V

IN1P to AGND

−0.3 V to VVDD

IN1N to AGND

−0.3 V to VVDD

OUT1 to AGND

−0.3 V to +5.75 V

IN2P to AGND

−0.3 V to VVDD

IN2N to AGND

−0.3 V to VVDD

OUT2 to AGND

−0.3 V to +5.75 V

EN/SY to AGND

−0.3 V to VVDD

ITEC to AGND

−0.3 V to +5.75 V

VTEC to AGND

−0.3 V to +5.75 V

Maximum Current

VREF to AGND

20 mA

OUT1 to AGND

50 mA

OUT2 to AGND

50 mA

ITEC to AGND

50 mA

VTEC to AGND

50 mA

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

Lead Temperature (Soldering, 10 sec)

260°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages, and is

based on a 4-layer standard JEDEC board.

Table 4.

Package Type

θJA

θJC

Unit

25-Ball WLCSP

48

0.6

°C/W

24-Lead LFCSP

37

1.65

°C/W

ESD CAUTION

Rev. A | Page 6 of 27

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