TPS25810

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SLVSCR1A – SEPTEMBER 2015 – REVISED SEPTEMBER 2015

6.4 Thermal Information

TPS25810

RVC (WQFN)

UNIT

20 PINS

Junction-to-ambient thermal resistance

39.3

°C/W

Junction-to-case (top) thermal resistance

43.4

°C/W

Junction-to-board thermal resistance

13

°C/W

Junction-to-top characterization parameter

0.7

°C/W

Junction-to-board characterization parameter

13

°C/W

Junction-to-case (bottom) thermal resistance

4.2

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.5 Electrical Characteristics

–40°C

k

(unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

OUT - POWER SWITCH

34

37

–40°C

34

46

m

Ω

–40°C

34

55

OUT to IN reverse leakage current –40°C

0

3

µA

OUT - CURRENT LIMIT

1.58

1.7

1.82

V

A

3.16

3.4

3.64

7

OUT - DISCHARGE

Discharge resistance

400

500

600

Ω

Bleed discharge resistance

100

150

250

k

Ω

REF

Output voltage

0.78

0.8

0.82

V

Short circuit current

9.5

15.3

µA

FAULT

Output low voltage

350

mV

Off-state leakage

1

µA

LD_DET

Output low voltage

350

mV

Off-state leakage

1

µA

OUT sourcing, rising threshold

1.8

1.95

2.1

A

current for load detect

125

mA

(1)

Pulse-testing techniques maintain junction temperature close to ambient temperature; thermal effects must be taken into account

separately.

(2)

These parameters are provided for reference only and do not constitute part of TI’s published specifications for purposes of TI’s product

warranty.

Copyright © 2015, Texas Instruments Incorporated

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