5

LM3880, LM3880-Q1

www.ti.com

SNVS451K – AUGUST 2006 – REVISED FEBRUARY 2016

Product Folder Links: LM3880 LM3880-Q1

Submit Documentation Feedback

Copyright © 2006–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and

specifications.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VCC

−0.3

6.0

V

EN, FLAG1, FLAG2, FLAG3

−0.3

6.0

V

Max Flag ON Current

50

mA

Max Junction Temperature

150

°C

Lead Temperature (Soldering, 5 s)

260

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings LM3880

VALUE

UNIT

Electrostatic discharge

±2

kV

(1)

AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 ESD Ratings LM3880-Q1

MAX

UNIT

Electrostatic discharge

±2

kV

6.4 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCC to GND

2.7

5.5

V

EN, FLAG1, FLAG2, FLAG3

−0.3

V

Junction Temperature

−40

125

°C

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Thermal Information

LM3880/

LM3880-Q1

UNIT

DBV

6 PINS

Junction-to-ambient thermal resistance

187.6

°C/W

Junction-to-case (top) thermal resistance

127.4

Junction-to-board thermal resistance

31.5

Junction-to-top characterization parameter

23.3

Junction-to-board characterization parameter

31.0