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TPS82130 Datasheet(PDF) 4 Page - Texas Instruments |
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TPS82130 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 25 page 4 TPS82130 SLVSCY5A – FEBRUARY 2016 – REVISED FEBRUARY 2016 www.ti.com Product Folder Links: TPS82130 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground pin. 7 Specifications 7.1 Absolute Maximum Ratings (1) MIN MAX UNIT Voltage at pins(2) VIN -0.3 20 V EN, SS/TR -0.3 VIN + 0.3 PG, FB -0.3 7 VOUT 0 7 Sink current PG 10 mA Module operating temperature –40 125 °C Storage temperature –40 125 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22- C101(2) ±1000 (1) The module operating temperature range includes module self temperature rise and IC junction temperature rise. In applications where high power dissipation is present, the maximum operating temperature or maximum output current must be derated. For applications where the module operates continuously at 125 °C temperature, the maximum lifetime is reduced to 50,000 hours. 7.3 Recommend Operating Conditions Over operating free-air temperature range, unless otherwise noted. MIN MAX UNIT VIN Input voltage 3 17 V VPG Power good pull-up resistor voltage 6 V VOUT Output voltage 0.9 5 V IOUT Output current 0 3 A TJ Module operating temperature range for 100,000 hours lifetime(1) -40 110 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953 7.4 Thermal Information THERMAL METRIC(1) SIL0008C UNIT 8-Pin µSiL RθJA Junction-to-ambient thermal resistance 71.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance n/a °C/W RθJB Junction-to-board thermal resistance n/a °C/W ψJT Junction-to-top characterization parameter 1.3 °C/W ψJB Junction-to-board characterization parameter 25.9 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
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