LM5023

SNVS961E – APRIL 2013 – REVISED JANUARY 2016

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Negative injection current when the QR pin is being driven below ground

4

mA

VSD

Maximum voltage

–0.3

45

V

VSD clamp continuous current

500

µA

SS, COMP, QR

–0.3

7

V

Voltage range

CS

–0.3

1.25

V

OUT

Gate-drive voltage at DRV

–0.3

Self-limiting

V

Peak OUT current, source

0.3

A

Peak OUT current sink

0.7

A

VCC

Bias supply voltage

–0.3

16

V

Operating junction temperature

–40

125

ºC

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under may cause permanent damage to the device. These are stress ratings only, and functional operation

of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

6.2 ESD Ratings

VALUE

UNIT

±2000

V

Electrostatic discharge

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN

MAX

UNIT

VCC

Bias supply voltage

8

14

V

VSD Current

2

100

µA

QR pin current

1

4

mA

Junction temperature

–40

125

ºC

4

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