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TPS71711DCKR Datasheet(PDF) 5 Page - Texas Instruments |
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TPS71711DCKR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 43 page 5 TPS717 www.ti.com SBVS068I – FEBRUARY 2006 – REVISED JANUARY 2016 Product Folder Links: TPS717 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) VEN absolute maximum rating is VIN + 0.3 V or 7 V, whichever is greater. 6 Specifications 6.1 Absolute Maximum Ratings over operating temperature range (unless otherwise noted), all voltages are with respect to GND (1) MIN MAX UNIT Voltage VIN –0.3 7 V VFB –0.3 3.6 VNR –0.3 3.6 VEN –0.3 VIN + 0.3 V (2) VOUT –0.3 7 Current IOUT Internally limited A Continuous total power dissipation PDISS See Thermal Information Operating junction temperature TJ –55 150 °C Storage temperature Tstg –55 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) When using feedback resistors that are smaller than recommended, the minimum output capacitance must be greater than 5 µF. 6.3 Recommended Operating Conditions over operating junction temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN Input voltage 2.5 6.5 V VOUT Output voltage 0.9 5 V IOUT Output current 0 150 mA VEN Enable voltage 0 VIN V COUT Output capacitor 1(1) 100 µF TJ Junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) TPS717 UNIT DCK (SC70) DRV (WSON) DSE (WSON) 5 PINS 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 279.2 71.1 190.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 57.5 96.5 94.9 °C/W RθJB Junction-to-board thermal resistance 74.1 40.5 149.3 °C/W ψJT Junction-to-top characterization parameter 0.8 2.7 6.4 °C/W ψJB Junction-to-board characterization parameter 73.1 40.9 152.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a 10.7 n/a °C/W |
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