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UCC27425DRG4 Datasheet(PDF) 4 Page - Texas Instruments |
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UCC27425DRG4 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page UCC27423, UCC27424, UCC27425 SLUS545E – NOVEMBER 2002 – REVISED DECEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VDD Supply voltage –0.3 16 V IOUT_DC Output current (OUTA, OUTB) DC 0.2 A IOUT_PULSED Pulsed, (0.5 μs) 4.5 A VIN Input voltage (INA, INB) –5 6 or VDD + 0.3 (whichever is larger) V Enable voltage (ENBA, ENBB) –0.3 6 or VDD + 0.3 (whichever is larger) V DGN package 3 W Power dissipation at D package 650 TA = 25°C mW P package 350 TJ Junction operating temperature –55 150 °C Lead temperature (soldering, 10 s) 300 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) When VDD ≤ 6 V, EN rating max value is 6 V; when VDD > 6 V, EN rating max value is VDD + 0.3 V. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2500 V(ESD) Electrostatic discharge V Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD Supply voltage 4 15 V INA and INB Input voltage –2 15 V ENA and ENB Enable voltage 0 15 V TJ Operating junction temperature –40 125 °C 7.4 Thermal Information UCC2742x THERMAL METRIC(1) D (SOIC) DGN (MSOP) P (PDIP) UNIT 8 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 107.3 56.6 55.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 52.2 52.8 45.3 °C/W RθJB Junction-to-board thermal resistance 47.3 32.6 32.6 °C/W ψJT Junction-to-top characterization parameter 10.2 1.8 23.0 °C/W ψJB Junction-to-board characterization parameter 46.8 32.3 32.5 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance – 5.9 – °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2002–2015, Texas Instruments Incorporated Product Folder Links: UCC27423 UCC27424 UCC27425 |
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