UCC27423, UCC27424, UCC27425

SLUS545E – NOVEMBER 2002 – REVISED DECEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage

–0.3

16

V

Output current (OUTA, OUTB) DC

0.2

A

Pulsed, (0.5

μs)

4.5

A

Input voltage (INA, INB)

–5

V

Enable voltage (ENBA, ENBB)

–0.3

V

DGN package

3

W

Power dissipation at

D package

650

mW

P package

350

Junction operating temperature

–55

150

°C

Lead temperature (soldering, 10 s)

300

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

7.2 ESD Ratings

VALUE

UNIT

±2500

Electrostatic discharge

V

±1500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

4

15

V

INA and INB

Input voltage

–2

15

V

ENA and ENB

Enable voltage

0

15

V

Operating junction temperature

–40

125

°C

7.4 Thermal Information

UCC2742x

D (SOIC)

DGN (MSOP)

P (PDIP)

UNIT

8 PINS

8 PINS

8 PINS

Junction-to-ambient thermal resistance

107.3

56.6

55.5

°C/W

Junction-to-case (top) thermal resistance

52.2

52.8

45.3

°C/W

Junction-to-board thermal resistance

47.3

32.6

32.6

°C/W

Junction-to-top characterization parameter

10.2

1.8

23.0

°C/W

Junction-to-board characterization parameter

46.8

32.3

32.5

°C/W

Junction-to-case (bottom) thermal resistance

–

5.9

–

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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