PG. 5

SUPERWORLD ELECTRONICS (S) PTE LTD

7. RELIABILITY AND TEST CONDITION

Resistance to Humidity

Thermal Shock

temperature of 40°C±2°C and relative humidity of

90% to 95% for 500+24/-0 hours.

Test board shall be kept in a thermo hygrostat at

3

2

1

Step

Normal temp

-40±2

30±3

30±3

Temperature (°C)

Times (min.)

them measurement shall be conducted.(Note 1)

temperature with a normal humidity for 2 to 2 hours

After the test, keep the test sample at a normal

PERFORMANCE

Reliability Test

ITEM

TEST CONDITION

High Temperature Load

temperature of 85°C±2°C for 500+24/-0 hours while

supplying (1) to (2) and (3) - (4) with rated current.

then measurement shall be conducted.(Note 1)

Life Test

Table 5

High Temperature

Bending Strength

Test board shall be kept in an atmosphere with

temperature of 85°C±2°C for 500+24/-0 hours.

After the test, keep the test sample at a normal

temperature with a normal humidity for 2 to 3 hours,

Test board shall be kept in a thermostatic oven with

After the test, keep the test sample at a normal

temperature with a normal humidity for 2 to 3 hours

After the test, keep the test sample at a normal

+85±2

4~5

44~5

Normal temp

repeated 5 times.

Steps 1 to 4 shown in Table 5 as one cycle shall be

them measurement shall be conducted.(Note 1)

temperature with a normal humidity for 2 to 3 hours,

Life Test

then measurement shall be conducted.(Note 1)

Warp : 1mm(03)

Testing board : Glass epoxy-resin substrate

Thickness : 1.6mm

Per table 1.

Per table 1.

Per table 1.

Per table 1.

Appearance:

No mechanical damage.

supplying (1) to (3) and (2) - (4) with rated Voltage

Common mode filter (RoHS Compliant)

NOTE : Specifications subject to change without notice. Please check our website for latest information.

26.03.2014

CMT03 SERIES