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M21050G-14 Datasheet(PDF) 5 Page - M/A-COM Technology Solutions, Inc. |
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M21050G-14 Datasheet(HTML) 5 Page - M/A-COM Technology Solutions, Inc. |
5 / 70 page 21050-DSH-001-F Mindspeed Technologies™ v Mindspeed Proprietary and Confidential List of Figures Figure 1-1. Recommended Data and Reference Clock Input Coupling Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Figure 1-2. 2.5 Gbps waveform after transmission through 25m of twinaxial cable (input to M21050) . . . . . . . . . .7 Figure 1-3. 2.5 Gbps waveform at M21050 output with input shown in Figure 1-2 (CDR enabled and IE at maximum setting) 8 Figure 1-4. Definition of Pre-Emphasis Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 Figure 1-5. Block Diagram of FRA Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 Figure 1-6. M21050 Pinout Diagram (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20 Figure 3-1. High-Speed Data Input Internal Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45 Figure 3-2. Reference Clock Input Internal Circuitry . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48 Figure 3-3. Jitter Tolerance Specification Mask . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50 Figure 3-4. Cross-Section of MLF Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51 Figure 3-5. 68-Pin Package Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52 Figure 3-6. 72-Pin Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53 Figure 3-7. PCB Footprint for 72-Pin 10 mm MLF Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54 Figure 3-8. PCB Pad Extensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Figure 3-9. Recommended Via Array for Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55 Figure 3-10. Trace Length Matching Using Serpentine Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 Figure 3-11. Loop Length Matching for Differential Traces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .57 |
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