AH114

¼ W High Linearity InGaP HBT Amplifier

Specifications and information are subject to change without notice

TriQuint Semiconductor, Inc • Phone +1-503-615-9000 • FAX: +1-503-615-8900 • e-mail: info-sales@tqs.com • Web site: www.TriQuint.com

Page 5 of 5 February 2012

AH114-89G (Green / Lead-free SOT-89 Package) Mechanical Information

This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded

(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.

Outline Drawing

Product Marking

The component will be marked with an “AH114 G”

designator with an alphanumeric lot code on the top

surface of the package.

ESD / MSL Information

ESD Rating:

Class 1A

Test:

Human Body Model (HBM)

Standard:

JEDEC Standard JESD22-A114

MSL Rating:

Level 3 at +260 °C convection reflow

Standard:

JEDEC Standard J-STD-020

Land Pattern

Mounting Config. Notes

1. Ground / thermal vias are critical for the proper performance of this device.

Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated

thru diameter of .25 mm (.010”).

2. Add as much copper as possible to inner and outer layers near the part to

ensure optimal thermal performance.

3. Mounting screws can be added near the part to fasten the board to a heatsink.

Ensure that the ground / thermal via region contacts the heatsink.

4. Do not put solder mask on the backside of the PC board in the region where

the board contacts the heatsink.

5. RF trace width depends upon the PC board material and construction.

6. Use 1 oz. Copper minimum.

7. All dimensions are in millimeters (inches). Angles are in degrees.

AH114G

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