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LP8557IAYFQT Datasheet(PDF) 4 Page - Texas Instruments

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Part # LP8557IAYFQT
Description  High-Efficiency LED Backlight Driver For Tablets
Download  49 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

LP8557IAYFQT Datasheet(HTML) 4 Page - Texas Instruments

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LP8557, LP85571
SNVSA15B – DECEMBER 2013 – REVISED DECEMBER 2015
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VDD
Voltage range on VDD pin
–0.3
6
V
VIO
Voltage range on digital IO pins
–0.3
6
V
VO
Voltage range on SW, FB, LED1 to LED6 pins
–0.3
31
V
TJ
Junction temperature
–30
125
°C
Tsldr
Maximum lead temperature (soldering)
260
°C
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values are with respect to the potential at the GND pin.
7.2 ESD Ratings
VALUE
UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2)
±500
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VDD
2.7
5.5
V
V (SW, FB, LED1 to LED6)
0
28
V
Ambient temperature, TA
–30
85
°C
Junction temperature, TJ
–30
125
°C
(1)
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability
(2)
All voltage values are with respect to the potential at the GND pin.
7.4 Thermal Information
LP8557/LP8557I
THERMAL METRIC(1)(2)
YFQ (DSBGA)
UNIT
16 PINS
RθJA
Junction-to-ambient thermal resistance
75.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
0.5
°C/W
RθJB
Junction-to-board thermal resistance
16.2
°C/W
ψJT
Junction-to-top characterization parameter
0.2
°C/W
ψJB
Junction-to-board characterization parameter
16.2
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
4
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Copyright © 2013–2015, Texas Instruments Incorporated
Product Folder Links: LP8557 LP85571


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