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LP8557IAYFQT Datasheet(PDF) 4 Page - Texas Instruments |
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LP8557IAYFQT Datasheet(HTML) 4 Page - Texas Instruments |
4 / 49 page LP8557, LP85571 SNVSA15B – DECEMBER 2013 – REVISED DECEMBER 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VDD Voltage range on VDD pin –0.3 6 V VIO Voltage range on digital IO pins –0.3 6 V VO Voltage range on SW, FB, LED1 to LED6 pins –0.3 31 V TJ Junction temperature –30 125 °C Tsldr Maximum lead temperature (soldering) 260 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to the potential at the GND pin. 7.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VDD 2.7 5.5 V V (SW, FB, LED1 to LED6) 0 28 V Ambient temperature, TA –30 85 °C Junction temperature, TJ –30 125 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability (2) All voltage values are with respect to the potential at the GND pin. 7.4 Thermal Information LP8557/LP8557I THERMAL METRIC(1)(2) YFQ (DSBGA) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 75.7 °C/W RθJC(top) Junction-to-case (top) thermal resistance 0.5 °C/W RθJB Junction-to-board thermal resistance 16.2 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 16.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. (2) Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. 4 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: LP8557 LP85571 |
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