TPS7H3301-SP

www.ti.com

SLVSCJ5 – DECEMBER 2015

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature, unless otherwise noted

(1)

MIN

MAX

UNIT

–0.36

3.6

EN

–0.3

6.5

V

PGND to AGND

–0.3

0.3

–0.3

3.6

V

PGOOD

–0.3

3.6

Peak output current

Internally limited

A

PG pin sink current

5

mA

Maximum operating junction temperature

–55

150

°C

Storage temperature

–55

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to the network ground pin unless otherwise noted.

7.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic

V

discharge

±750

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

Supply voltage

2.375

3.5

VLDOIN

0.9

3.5

EN, VTTSNS

–0.1

3.5

VDDQSNS

1.0

3.5

V

Voltage

–0.1

3.5

VTTREF

–0.1

1.8

PGND

–0.1

0.1

Operating junction temperature

–55

125

°C

7.4 Thermal Information

TPS7H3301-SP

HKR (CFP)

UNIT

16 PINS

Junction-to-case (bottom) thermal resistance

0.6

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Do not allow package body temperature to exceed 265°C at any time or permanent damage may result.

(3)

Maximum power dissipation may be limited by overcurrent protection.

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