MICROWAVE CORPORATION

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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

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v03.0304

HMC158

GaAs MMIC FREQUENCY

DOUBLER, 1.3 - 4.0 GHz INPUT

Handling Precautions

Follow these precautions to avoid permanent damage.

Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid clean-

ing systems.

Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.

Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and

bias cables to minimize inductive pick-up.

General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent

tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet,

tweezers, or fingers.

Mounting

The chip is back-metallized and can be die mounted with AuSn eutectic preforms or

with electrically conductive epoxy. The mounting surface should be clean and flat.

Epoxy Die Attach:

Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around

the perimeter of the chip once it is placed into position.

Cure epoxy per the manufacturer’s schedule.

Wire Bonding

Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage tem-

perature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams

is recommended. Use the minimum level of ultrasonic energry to achieve reliable wirebonds. Wirebonds

should be started on the chip and terminated on the package. RF bonds should be as short as possible.