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DMN2600UFB Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMN2600UFB
Description  25V N-CHANNEL ENHANCEMENT MODE MOSFET
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN2600UFB Datasheet(HTML) 2 Page - Diodes Incorporated

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DMN2600UFB
Document number: DS31983 Rev. 5 - 2
2 of 6
www.diodes.com
May 2015
© Diodes Incorporated
DMN2600UFB
Maximum Ratings (@TA = +25°C unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
25
V
Gate-Source Voltage
VGSS
±8
V
Continuous Drain Current (Note 4)
Steady
State
TA = +25°C
TA = +85°C
ID
1.3
0.9
A
Pulsed Drain Current
IDM
3.0
A
Thermal Characteristics (@TA = +25°C unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 4)
PD
0.54
W
Thermal Resistance, Junction to Ambient @TA = +25°C
RθJA
234
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
BVDSS
25
-
-
V
VGS = 0V, ID = 250μA
Zero Gate Voltage Drain Current TJ = +25°C
IDSS
-
-
1
A
VDS = 25V, VGS = 0V
Gate-Source Leakage
IGSS
-
-
10
A
VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
VGS(th)
0.45
-
1.0
V
VDS = VGS, ID = 250μA
Static Drain-Source On-Resistance
RDS (ON)
-
-
350
m
Ω
VGS = 4.5V, ID = 200mA
450
VGS = 2.5V, ID = 100mA
600
VGS = 1.8V, ID = 75mA
Forward Transfer Admittance
|Yfs|
40
-
-
mS
VDS = 3V, ID = 200mA
Diode Forward Voltage
VSD
-
-
1.2
V
VGS = 0V, IS = 300mA
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
Ciss
-
70.13
-
pF
VDS = 15V, VGS = 0V,
f = 1.0MHz
Output Capacitance
Coss
-
7.56
-
pF
Reverse Transfer Capacitance
Crss
-
5.59
-
pF
Gate Resistance
Rg
-
72.3
-
Ω
VDS =0V, VGS = 0V, f = 1MHz
Total Gate Charge
Qg
-
0.85
-
nC
VGS = 4.5V, VDS = 15V,
ID = 1A
Gate-Source Charge
Qgs
-
0.16
-
nC
Gate-Drain Charge
Qgd
-
0.11
-
nC
Turn-On Delay Time
tD(on)
-
4.1
-
ns
VDS = 15V, RL=15Ω
VGS = 10V, RG = 6Ω
Turn-On Rise Time
tr
-
11.5
-
ns
Turn-Off Delay Time
tD(off)
-
34.8
-
ns
Turn-Off Fall Time
tf
-
20.9
-
ns
Notes:
4. Device mounted on FR-4 substrate PCB board, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to production testing.


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