LP38691, LP38693, LP38691-Q1, LP38693-Q1

SNVS321O – JANUARY 2005 – REVISED DECEMBER 2015

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Pin Functions

PIN

I/O

DESCRIPTION

TO-

SOT-

NAME

WSON

252

223

WSON Only - The DAP (Exposed Pad) functions as a thermal connection when

DAP

—

√

√

—

—

soldered to a copper plane. See WSON Mounting section for more information.

The EN pin allows the part to be turned ON and OFF by pulling this pin high or

EN

—

—

3

1

I

low.

Circuit ground for the regulator. For the TO-252 and SOT-223 packages this is

GND

TAB

2

2

5

—

thermally connected to the die and functions as a heat sink when the soldered

down to a large copper plane.

This is the input supply voltage to the regulator. For WSON devices, both IN

IN

3

1, 6

1, 6

4

I

pins must be tied together for full current operation (250 mA maximum per pin).

OUT

1

4

4

3

O

Regulated output voltage

WSON Only - Output SNS pin allows remote sensing at the load which eliminate

SNS

—

5

5

—

I

the error in output voltage due to voltage drops caused by the resistance in the

traces between the regulator and the load. This pin must be tied to OUT.

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2)

MIN

MAX

UNIT

Lead temp. (Soldering, 5 seconds)

260

°C

Internally Limited

V

V(max) All pins (with respect to GND)

–0.3

12

V

(4)

Internally Limited

V

Junction temperature

–40

150

°C

−65

150

(1)

Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for

which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical

Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.

(2)

If Military/Aerospace specified devices are required, contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(3)

At elevated temperatures, device power dissipation must be derated based on package thermal resistance and heatsink values (if a

heatsink is used). When using the WSON package, refer to AN-1187 Leadless Leadframe Package (LLP), SNOA401, and the WSON

Mounting section in this datasheet. If power dissipation causes the junction temperature to exceed specified limits, the device goes into

thermal shutdown.

(4)

If used in a dual-supply system where the regulator load is returned to a negative supply, the output pin must be diode clamped to

ground.

7.2 ESD Ratings: LP38691 and LP38693

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 ESD Ratings: LP38691-Q1 and LP38693-Q1

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.4 Recommended Operating Conditions

MIN

NOM

MAX

UNIT

2.7

10

V

Operating junction temperature

−40

125

°C

4

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