RoHS Compliant

Rev V6

MA4SPS402

M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

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Handling

All semiconductor chips should be handled with care to avoid damage or contamination from perspiration and skin

oils. The use of plastic tipped tweezers or vacuum pickups is strongly recommended for individual components.

Bulk handling should insure that abrasion and mechanical shock are minimized.

Die Attach

Attachment to a circuit board is made simple through the use of surface mount technology. Mounting pads are

conveniently located on the bottom surface of these devices and are removed from the active junction locations.

These devices are well suited for solder attachment onto hard and soft substrates. The use of 80/20, Au/Sn,

60/40, Sn/Pb or RoHS compliant solders is recommended. Conductive silver epoxy solder may also be used but

could result in an increase in series and thermal resistance.

When soldering these devices to a hard substrate, hot gas die bonding is preferred. We recommend utilizing a

vacuum tip and force of 60 to 100 grams applied to the top surface of the device. When soldering to soft

substrates, it is recommended to use a lead-tin interface at the circuit board mounting pads. Position the die so

that its mounting pads are aligned with the circuit board mounting pads and reflow the solder by heating the circuit

trace near the mounting pads while applying 60 to 100 grams of force perpendicular to the top surface of the die.

The solder joint must not be made one pad at a time. Doing so could create unequal heat flow and produce

thermal and/or mechanical stresses. It is also not recommended to reflow solder by causing heat to flow through

the top surface of the die. Since the HMIC glass is transparent, the edges of the mounting pads can be visually

inspected through the die after attach is completed.

Recommended temperature and re-flow profiles for 60/40, Sn/Pb and RoHS compliant solders are provided in

Application Note M538 , “Surface Mounting Instructions“.

Ordering Information

MA4SPS402 SURMOUNTS may be ordered in either gel packs or tape and reeled by adding the appropriate suf-

fix per the table below. Tape and reel dimensions are provided in Application Note M513 located on the M/A-COM

website at www.macomtech.com.

Part Number

Waffle Pack

Tape and Reel

Gel Pack

Pocket Tape

MA4SPS402

MADP-000402-12530P

MADP-000402-12530G