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MASW-011036-1413WR Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc.

Part # MASW-011036-1413WR
Description  Ka-Band High Power Terminated SPDT PIN Switch
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Manufacturer  MA-COM [M/A-COM Technology Solutions, Inc.]
Direct Link  http://www.macomtech.com
Logo MA-COM - M/A-COM Technology Solutions, Inc.

MASW-011036-1413WR Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc.

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Ka-Band High Power Terminated SPDT PIN Switch
26 - 40 GHz
Rev. V7
MASW-011036
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1
Features
 Broadband Performance, 26 to 40 GHz
 Low Loss <1 dB
 High Isolation >38 dB
 Up to 13 W CW Power, +85°C
 Die with G-S-G RF Pads and DC Bias Pads
 Includes DC Blocks and RF Bias Networks
 23 dBm power handling in terminated port
Description
The MASW-011036 is a high power SPDT with 50 Ω
terminated RF ports. This broadband, high linearity,
SPDT
switch
was
developed
for
Ka–Band
applications that require up to 13 Watts CW power
handling at an environmental temperature of +85°C
while maintaining low insertion loss and high
isolation.
The SPDT MMIC utilizes MACOM’s proven AlGaAs
PIN diode technology. The switch is fully passivated
with silicon nitride and has an added polymer layer
for scratch protection. The protective coating
prevents damage to the junction and the anode
air-bridge during handling and assembly. The die
has backside metallization to facilitate an epoxy die
attach process.
Pin Configuration:
(Back Metal is RF, DC, and Thermal Ground)
Pin #
Function
1
RFCOMMON
2
BIAS 1
3
RF1
4
RF2
5
BIAS 2
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
Ordering Information1
Part Number
Package
MASW-011036-1413WR
Separated Die on 7” Grip
Ring1, Electronic Map
MASW-011036-1413RI
Separated Die on 7” Grip
Ring1, Inked Wafer
MASW-011036-14130G
Die in Gel Pack1
MASW-011036-001SMB
Sample Evaluation Board
1. Die quantity varies.
Functional Diagram
RF2
RFCOMMOM
Bias1
Bias2
3
1
4
5
2
RF1
L
L
C
C
C
C
C
C
SW2
SW1
Rterm2
(50 Ω)
Rterm1
(50 Ω)
R
R


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