EN/SYNC

AGND

VIN

PGND

SW

BOOT

VCC

FB

Thermal Pad

(9)

1

2

3

4

5

6

7

8

LMR23625

www.ti.com

SNVSAH3 – DECEMBER 2015

5 Pin Configuration and Functions

DDA Package

8-Pin HSOIC

Top View

Pin Functions

PIN

DESCRIPTION

NAME

NO.

Switching output of the regulator. Internally connected to both power MOSFETs. Connect to

SW

1

O

power inductor.

Boot-strap capacitor connection for high-side driver. Connect a high quality 470 nF capacitor

BOOT

2

O

from BOOT to SW.

Internal bias supply output for bypassing. Connect bypass capacitor from this pin to AGND.

VCC

3

O

Do not connect external loading to this pin. Never short this pin to ground during operation.

FB

4

I

Feedback input to regulator, connect the feedback resistor divider tap to this pin.

Enable input to regulator. High = On, Low = Off. Can be connected to VIN. Do not float.

Adjust the input under voltage lockout with two resistors. See the Enable and Adjusting

EN/SYNC

5

I

Under voltage Lockout section. The internal oscillator can be synchronized to an external

clock by coupling a positive pulse into this pin through a small coupling capacitor. See the

frequency synchronization section for detail.

Analog ground pin. Ground reference for internal references and logic. Connect to system

AGND

6

G

ground.

VIN

7

I

Input supply voltage with 4 V to 36 V operating range.

Power ground pin, connected internally to the low side power FET. Connect to system

PGND

8

G

Low impedance connection to AGND. Connect to PGND on PCB. Major heat dissipation

PAD

9

G

path of the die. Must be used for heat sinking to ground plane on PCB.

(1)

I = Input, O = Output, G = Ground.

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