Push-Pull CATV Amplifier

45 - 1200 MHz

Rev. V2

MAAM-011177

9

9

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9

Exposed

Pad

Plated Vias

Recommended Thermal Via Array

If a thermal pedestal is not desired, a dense

through-via pattern with copper fill or sufficient hole

plating is required for operation at a reliable

junction temperature. Generally, filled vias and thin

substrates are preferable.

An example layout using 10-mil (0.254 mm)

finished hole diameter, 62-mil (1.575 mm) finished

PCB bottom heated to 85°C using 1.5-mil (38

micron) minimum copper via plating. Estimated

recommended that thermal vias extend beyond the

exposed pad and amplifier package as shown.

†

Reference Application Note M538 for lead-free solder reflow recommendations and PCB footprint information.

Meets JEDEC moisture sensitivity level 1 requirements.

Plating is 100% matte tin over copper.

NOTES:

1. REFERENCE JEDEC MO-153-AB FOR ADDITIONAL DIMENSIONAL AND

TOLERANCE INFORMATION.

2. ALL DIMENSIONS SHOWN AS INCHES/MM.