MICROWAVE CORPORATION

8 - 147

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order Online at www.hittite.com

8

HMC406MS8G

GaAs InGaP HBT MMIC

POWER AMPLIFIER, 5.0 - 6.0 GHz

v02.1202

Evaluation PCB

The circuit board used in the final application should use

RF circuit design techniques. Signal lines should have

50 ohm impedance while the package ground leads

and exposed paddle should be connected directly to the

ground plane similar to that shown. A sufficient number

of VIA holes should be used to connect the top and

bottom ground planes. The evaluation board should be

mounted to an appropriate heat sink. The evaluation cir-

cuit board shown is available from Hittite upon request.

List of Material

Item

Description

J1 - J2

PC Mount SMA RF Connector

J3

2mm DC Header

C1 - C3

330 pF Capacitor, 0603 Pkg.

C4

0.6 pF Capacitor, 0603 Pkg.

C5

1.6 pF Capacitor, 0603 Pkg.

C6

2.2 µF Capacitor, Tantalum

L1

3.9 nH Inductor, 0603 Pkg.

U1

HMC406MS8G Amplifier

PCB*

105021 Eval Board

* Circuit Board Material: Rogers 4350