SOLDERABLE ENDS

D2

D2=D1

＋0

－0.20

0.5± 0.1

0.5± 0.1

4.9± 0.2

FEATURES

Metal-Semiconductor junction with guard ring

Epitaxial construction

Low forward voltage drop,low switching losses

High surge capability

MECHANICAL DATA

Case:JEDEC DO--213AB,molded plastic

Terminals: Solderable per

MIL- STD-202,method 208

Polarity: Color band denotes cathode

Weight: 0.0046 ounces,0.116 grams

Mounting position: Any

Ratings at 25

ambient temperature unless otherwise specified.

Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate by 20%.

UNITS

Maximum recurrent peak reverse voltage

V

Maximum RMS voltage

V

Maximum DC blocking voltage

V

Maximum average forw ard rectified current

@T

Peak forw ard surge current

8.3ms single half-sine-w ave

superimposed on rated load

Maximum reverse current

@T

at rated DC blocking voltage

@T

Typical junction capacitance

(Note2)

pF

Typical thermal resistance

(Note3)

/W

Operating junction temperature range

Storage temperature range

A

For use in low voltage,high frequency inverters free

SCHOTTKY BARRIER RECTI FI ERS

V O L T AG E

R ANG E : 2 0 - - - 4 0 V CURRENT: 1.0 A

DO-213AB

The plastic material carries U/L recognition 94V-0

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

SM5817

3.Thermal resistance junction to ambient,vertical PC board mounting,0.5"(12.7mm)lead length.

mA

NOTE: 1. Pulse test : 300

s pulse width,1% duty cy cle.

2. Measured at 1.0MH

A

80

- 55 ---- + 150

- 55 ---- + 150

110

1.0

10.0

1.0

40

Maximum instantaneous forw ard voltage @ 1.0A

@ 3.0A

14

20

V

SM5818

SM5819

40

28

30

21

30

25

20

0.90

0.60

0.45

0.75

0.55

0.875

SURFACE MOUNT

Dimensions in millimeters

SM5817 THRU SM5819

MDD Catalog Number