Silicon SP4T Surface Mount HMIC PIN Diode Switch

50 MHZ - 20 GHz

Rev. V5

MASW-004103-1365

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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.

Visit www.macom.com for additional data sheets and product information.

For further information and support please visit:

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Sample Board

Samples test boards are available upon request

Handling Procedures

Attachment to a circuit board is made simple through the use of standard surface mount technology. Mounting

pads are conveniently located on the bottom of the chip and are removed from the active junction locations

making it well suited for solder attachment. Connections may be made onto hard or soft substrates via the use of

80Au/20Sn, or RoHS compliant solders. Typical re-flow profiles for provided in Application Note M538 , “Surface

Mounting Instructions“ and can viewed in the Customer Support, Technical Resources section of the MA-COM

Technology Solutions website at www.macomtech.com.

For applications where the average power is ≤ 1W, a thermally conductive silver epoxy may also be used. Cure

per manufacturers recommended time and temperature. Typically 1 hour at 150°C.

When soldering these devices to a hard substrate, a solder re-flow method is preferred. A vacuum pick up tool

with a soft tip is recommended while placing the chip . When soldering to soft substrates, such as Duroid, a soft

solder is recommended at the circuit board to chip mounting pad interface to minimize stress due to any TCE mis-

matches that may exist. Position the die so that its mounting pads are aligned with the circuit board land pads.

Solder reflow should not be performed by causing heat to flow through the top surface of the die to the back.

Since the HMIC glass is transparent, the edges of the mounting pads can be visually inspected through the die

after attachment is completed.

PCB Land Pattern (All dims. in µm)

DC & RF GND