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GRM1555C1H3R3CZ01 Datasheet(PDF) 8 Page - Skyworks Solutions Inc. |
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GRM1555C1H3R3CZ01 Datasheet(HTML) 8 Page - Skyworks Solutions Inc. |
8 / 11 page PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 8 February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E Package Dimensions The PCB layout footprint for the SE2605L is provided in Figure 5. Typical part markings are shown in Figure 6. Package dimensions are shown in Figure 7, and tape and reel dimensions are provided in Figure 8. Package and Handling Information Since the device package is sensitive to moisture absorption, it is baked and vacuum packed before shipping. Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly. The SE2605L is rated to Moisture Sensitivity Level 3 (MSL3) at 260 C. It can be used for lead or lead-free soldering. For additional information, refer to the Skyworks Application Note, Solder Reflow Information, document number 200164. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format. 16 4 9 15 14 13 3 10 2 11 1 12 5 6 7 8 16 4 9 15 14 13 3 10 2 11 1 12 5 6 7 8 16 4 9 15 14 13 3 10 2 11 1 12 5 6 7 8 Board Metal and Via Pattern (Note 4) Solder Mask Pattern (Note 6) Stencil Pattern (Note 5) 63% Solder Coverage on Center Pad NOTES: 1. All dimensions are in millimeters. 2. Dimensions and tolerances per ASME Y14.5M-1994. 3. Unless specified, dimensions are symmetrical about center lines. 4. Via hole recommendations: Size (Ø): 0.150 to 0.300 mm Pitch: 0.500 Cu via wall plating: 30-35 μm Should be tented with solder mask on PCB backside and filled with solder. 5. Stencil recommendations: 0.127 mm stencil thickness. 6. Solder mask recommendations: Aperture array to tarret approximately 50 to 80% coverage of solder mask openings, except as noted. Y0264 0.10 0.675 Typ 0.675 Typ 0.10 3.20 0.25 Typ 0.50 Typ 3.20 0.500 Typ 1.70 0.35 Typ 3.30 3.30 0.60 Typ 0.500 Typ 3 x 3 QFN Package Outline 0.58 Typ 1.70 0.58 Typ 1.80 0.500 Typ 3.20 1.80 0.50 Typ 3.20 0.25 Typ 5X Ø0.254 Figure 5. PCB Layout Footprint for the SE2605L |
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