PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

8

February 10, 2016 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203009E

Package Dimensions

The PCB layout footprint for the SE2605L is provided in

Figure 5. Typical part markings are shown in Figure 6. Package

dimensions are shown in Figure 7, and tape and reel

dimensions are provided in Figure 8.

Package and Handling Information

Since the device package is sensitive to moisture absorption, it

is baked and vacuum packed before shipping. Instructions on

the shipping container label regarding exposure to moisture

after the container seal is broken must be followed. Otherwise,

problems related to moisture absorption may occur when the

part is subjected to high temperature during solder assembly.

The SE2605L is rated to Moisture Sensitivity Level 3 (MSL3) at

260

C. It can be used for lead or lead-free soldering. For

additional information, refer to the Skyworks Application Note,

Solder Reflow Information, document number 200164.

Care must be taken when attaching this product, whether it is

done manually or in a production solder reflow environment.

Production quantities of this product are shipped in a standard

tape and reel format.

16

4

9

15

14

13

3

10

2

11

1

12

5

6

7

8

16

4

9

15

14

13

3

10

2

11

1

12

5

6

7

8

16

4

9

15

14

13

3

10

2

11

1

12

5

6

7

8

Board Metal and Via Pattern

(Note 4)

Solder Mask Pattern

(Note 6)

Stencil Pattern

(Note 5)

63% Solder Coverage on Center Pad

NOTES:

1. All dimensions are in millimeters.

2. Dimensions and tolerances per ASME Y14.5M-1994.

3. Unless specified, dimensions are symmetrical about center lines.

4. Via hole recommendations:

Size (Ø): 0.150 to 0.300 mm

Pitch: 0.500

Cu via wall plating: 30-35 μm

Should be tented with solder mask on PCB backside and filled with solder.

5. Stencil recommendations: 0.127 mm stencil thickness.

6. Solder mask recommendations: Aperture array to tarret approximately 50 to 80% coverage

of solder mask openings, except as noted.

Y0264

0.10

0.675 Typ

0.675 Typ

0.10

3.20

0.25 Typ

0.50 Typ

3.20

0.500

Typ

1.70

0.35 Typ

3.30

3.30

0.60 Typ

0.500

Typ

3 x 3 QFN

Package Outline

0.58

Typ

1.70

0.58 Typ

1.80

0.500

Typ

3.20

1.80

0.50 Typ

3.20

0.25 Typ

5X Ø0.254

Figure 5. PCB Layout Footprint for the SE2605L