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ERJ2RKF2672 Datasheet(PDF) 5 Page - Skyworks Solutions Inc. |
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ERJ2RKF2672 Datasheet(HTML) 5 Page - Skyworks Solutions Inc. |
5 / 11 page PRELIMINARY DATA SHEET • SE2605L: HIGH POWER (+26 dBm) 802.11n WLAN PA Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com 203009E • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • February 10, 2016 5 Evaluation Board Description The SE2605L Evaluation Board is used to test the performance of the SE2605L WLAN PA. A schematic diagram of the SE2605L Evaluation Board is shown in Figure 3. A photograph of the Evaluation Board is shown in Figure 4. Component values for the SE2605L Evaluation Board are listed in Table 7. Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration: Paths to ground should be made as short as possible. The ground pad of the SE2605L has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required. For further information, refer to the Skyworks Application Note PCB Design Guidelines for High Power Dissipation Packages, document number 201211. Bypass capacitors should be used on the DC supply lines. Refer to the schematic drawing in Figure 3 for further details. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation. NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the life of the device. Evaluation Board Setup Procedure 1. Connect system ground to pin 1 of connector J5. 2. Apply 5.0 V to pins 3 and 4 of connector J5. 3. By applying 3.3 V on PA_EN (pin 1 of the J4 header), the PA is enabled. By placing a ground on PA_EN, the PA is disabled and placed in a shutdown state, drawing minimal current. 4. The 2 GHz amplifier performance can be monitored by applying an RF signal to connector J1 (RF_IN). Monitor the output power on the RF_OUT port connector, J1. Detector performance can be monitored on pin 4 of connector J4. CAUTION: Do not overdrive the amplifier by applying too much RF on the device input. A suitable starting input power setting is –20 dBm. |
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