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XL1000-BD Datasheet(PDF) 6 Page - M/A-COM Technology Solutions, Inc. |
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XL1000-BD Datasheet(HTML) 6 Page - M/A-COM Technology Solutions, Inc. |
6 / 10 page Low Noise Amplifier 20.0-40.0 GHz Rev. V1 XL1000-BD 6 6 M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Visit www.macom.com for additional data sheets and product information. For further information and support please visit: https://www.macom.com/support 6 Mechanical Drawing Bias Arrangement Bypass Capacitors - See App Note [2] (Note: Engineering designator is28LN3UA0338) Units:millimeters(inches) Bond pad dimensionsare shown to center of bond pad. Thickness:0.110 +/- 0.010 (0.0043 +/- 0.0004),Backside isground,Bond Pad/Backside Metallization:Gold All Bond Padsare 0.100 x 0.100 (0.004 x 0.004). Bond pad centersare approximately 0.109 (0.004) from the edge of the chip. Dicing tolerance:+/- 0.005 (+/- 0.0002).Approximate weight:1.239 mg. Bond Pad #1 (RFIn) Bond Pad #2 (RFOut) Bond Pad #3 (Vd) Bond Pad #4 (Vd) 2 1 3 4 1.000 (0.039) 0.678 (0.027) 0.0 0.0 2.000 (0.079) 1.880 (0.074) 0.309 (0.012) 0.678 (0.027) 2 1 3 4 Vd RF In RF Out RF Out RF In Vd XL1000-BD |
Similar Part No. - XL1000-BD_15 |
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Similar Description - XL1000-BD_15 |
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