TPS61176

SLVSBM5B – DECEMBER 2012 – REVISED AUGUST 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

VIN, PWM/EN, MODE/FAULT

–0.3

7

V

SW

–0.3

40

V

IFB1 to IFB6

–0.3

20

V

All other pins

–0.3

3.6

V

Continuous power dissipation

See Thermal Information

Operating junction temperature

–40

150

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

6.2 ESD Ratings

VALUE

UNIT

±4000

Electrostatic

±2000

V

discharge

Machine model

±200

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Bias voltage to device (see Figure 18)

2.7

6.5

V

Input voltage to inductor (see Figure 18)

2.7

24

V

Output voltage range

38

V

L

Inductor

4.7

6.8

10

µH

Input capacitor

1.0

2.2

µF

Output capacitor

2.2

4.7

10

µF

COMP capacitor

0.47

1

µF

Input PWM signal frequency

0.1

22

kHz

Operating ambient temperature

–40

85

°C

Operating junction temperature

–40

125

°C

6.4 Thermal Information

TPS61176

RTE (WQFN)

UNIT

16 PINS

Junction-to-ambient thermal resistance

43

°C/W

Junction-to-case (top) thermal resistance

44.4

°C/W

Junction-to-board thermal resistance

14.4

°C/W

Junction-to-top characterization parameter

0.6

°C/W

Junction-to-board characterization parameter

14.3

°C/W

Junction-to-case (bottom) thermal resistance

3.3

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

4

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