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TPS61176RTER Datasheet(PDF) 4 Page - Texas Instruments |
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TPS61176RTER Datasheet(HTML) 4 Page - Texas Instruments |
4 / 34 page TPS61176 SLVSBM5B – DECEMBER 2012 – REVISED AUGUST 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VIN, PWM/EN, MODE/FAULT –0.3 7 V SW –0.3 40 V Voltage range(2) IFB1 to IFB6 –0.3 20 V All other pins –0.3 3.6 V Continuous power dissipation See Thermal Information Operating junction temperature –40 150 °C Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltage values are with respect to network ground terminal. 6.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 Electrostatic V(ESD) Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±2000 V discharge Machine model ±200 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Bias voltage to device (see Figure 18) 2.7 6.5 V VIN Input voltage to inductor (see Figure 18) 2.7 24 V VOUT Output voltage range VIN 38 V L Inductor 4.7 6.8 10 µH CI Input capacitor 1.0 2.2 µF CO Output capacitor 2.2 4.7 10 µF CCOMP COMP capacitor 0.47 1 µF FPWM_I Input PWM signal frequency 0.1 22 kHz TA Operating ambient temperature –40 85 °C TJ Operating junction temperature –40 125 °C 6.4 Thermal Information TPS61176 THERMAL METRIC(1) RTE (WQFN) UNIT 16 PINS RθJA Junction-to-ambient thermal resistance 43 °C/W RθJC(top) Junction-to-case (top) thermal resistance 44.4 °C/W RθJB Junction-to-board thermal resistance 14.4 °C/W ψJT Junction-to-top characterization parameter 0.6 °C/W ψJB Junction-to-board characterization parameter 14.3 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 3.3 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2012–2015, Texas Instruments Incorporated Product Folder Links: TPS61176 |
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