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FH18-51S-0.3SHW Datasheet(PDF) 7 Page - Hirose Electric |
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FH18-51S-0.3SHW Datasheet(HTML) 7 Page - Hirose Electric |
7 / 8 page 53 BRecommended Temperature Profile Start Time (seconds) 60 25ç (60 seconds) (20-30 seconds) (30 seconds) 60-90 seconds Preheating Soldering 0 50 100 150 150ç 160ç 240ç 200ç 3 seconds or less 200 250 120 180 HRS test conditions Solder method :Reflow, IR/hot air (Nihon Den-netsu Co., Ltd.’s Part Number: SENSBY NR-2) Environment :Room air Solder composition :Paste, 63%Sn/37%Pb (Senju Metal Industry, Co., Ltd.’s Part Number: OZ63-201C-50-9) Test board :Glass epoxy 70mm∞70mm∞1.6mm thick Land dimensions :0.3mm∞1.25mm Metal mask :0.25mm∞1.25mm∞0.15mm thick This temperature profile is based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. |
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