53

BRecommended Temperature Profile

Start

Time (seconds)

60

25ç (60 seconds)

(20-30 seconds)

(30 seconds)

60-90 seconds

Preheating

Soldering

0

50

100

150

150ç

160ç

240ç

200ç

3 seconds or less

200

250

120

180

HRS test conditions

Solder method

:Reflow, IR/hot air

(Nihon Den-netsu Co., Ltd.’s

Part Number: SENSBY NR-2)

Environment

:Room air

Solder composition

:Paste, 63%Sn/37%Pb

(Senju Metal Industry, Co., Ltd.’s Part

Number: OZ63-201C-50-9)

Test board

:Glass epoxy 70mm∞70mm∞1.6mm thick

Land dimensions

:0.3mm∞1.25mm

Metal mask

:0.25mm∞1.25mm∞0.15mm thick

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.