9

BFH23 Series FPC Construction (Recommended Specifications)

1. Using Single-sided FPC

Material Name

Covering film layer.

Cover adhesive

Surface treatment

Copper foil

Base adhesive

Base film

Reinforcement material adhesive

Stiffener

Polyamide

1 mil thick.

Tin-lead plating

Cu

1oz

Polyamide

1 mil thick

Heat-hardened adhesive

Polyamide

3 mil thick

Total

25

25

5

35

25

25

30

75

195

Material

Thickness (µm)

2. Using Double-sided FPC

3. Precautions

Material Name

Covering layer film

Cover adhesive

Surface treatment

Through-hole copper

Copper foil

Base adhesive

Base film

Base adhesive

Copper foil

Cover adhesive

Covering layer film

Reinforcement material adhesive

Stiffener

Polyamide

1 mil thick

Tin-lead plating

Cu

Cu

1/2oz

Polyamide

1 mil thick

Cu

1/2oz

Polyamide

1 mil thick

Heat-hardened adhesive

Polyamide

1 mil thick

Total

25

25

5

15

18

18

25

18

18

25

25

25

25

199

Material

Thickness (µm)

Note : Recommended specification for FPC 0.2±0.03 mm thick.

FPC/FFC Manufactures' Contact List

Sumitomo Bakelite Co., Ltd. Flexible Printed Circuit Board Division

TEL:+81 3 5462 4191

5-8, Higashi-shinagawa 2-chome, Shinagawa-ku, Tokyo, Japan

FAX:+81 3 5462 4882

Fujikura Ltd. Electronics Global Marketing Department

TEL:+81 3 5606 1165

1-5-1, Kiba, Koto-ku, Tokyo, Japan

FAX:+81 3 5606 1530

NOK Corporation Sales Division Overseas Business Department

TEL:+81 3 3432 6976/8415

1-12-15, Shiba-Daimon, Minato-ku, Tokyo, Japan

FAX:+81 3 3432 3919