Rev 1.1

vicorpower.com

Page 8 of 38

05/2016

800 927.9474

BCM3814x60E10A5yzz

Case Temperature (°C)

36 – 60V

0

20

40

60

80

100

120

140

160

180

200

-60

-40

-20

0

20

40

60

80

100

120

LO Side Current (% I

0

10

20

30

40

50

60

70

80

90

100

110

0

20

40

60

80

100

Figure 3 — Specified HI side start-up into load current and external capacitance

HI Side Voltage (V)

I

LO_OUT_DC

I

LO_OUT_PULSE

0

25

50

75

100

125

150

175

200

36 38 40 42 44 46 48 50 52 54 56 58 60

HI Side Voltage (V)

P

LO_OUT_DC

P

LO_OUT_PULSE

0

250

500

750

1000

1250

1500

1750

2000

36 38 40 42 44 46 48 50 52 54 56 58 60

Figure 1 — Specified thermal operating area

1. The BCM in a VIA Package is cooled through bottom case (bottom housing).

2. The thermal rating of the BCM in a VIA Package is based on typical measured device efficiency.

3. The case temperature in the graph is the measured temperature of the bottom housing, such that operating internal junction temperature of the BCM in a

VIA Package does not exceed 125°C.