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AMC1200TDWVRQ1 Datasheet(PDF) 4 Page - Texas Instruments |
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AMC1200TDWVRQ1 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 30 page 4 AMC1200-Q1 SBAS585A – SEPTEMBER 2012 – REVISED JANUARY 2016 www.ti.com Product Folder Links: AMC1200-Q1 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. 6 Specifications 6.1 Absolute Maximum Ratings over operating ambient temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage VDD1 to GND1 or VDD2 to GND2 –0.5 6 V Input voltage VINP, VINN GND1 – 0.5 VDD1 + 0.5 V Input current VINP, VINN, VOUTP, VOUTN –10 10 mA Junction temperature, TJ –40 150 °C Storage temperature, Tstg –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC-Q100, Classification Level H2(1) ±2500 V Charged-device model (CDM), per AEC-Q100, Classification Level C3B(2) ±1000 6.3 Recommended Operating Conditions over operating ambient temperature range (unless otherwise noted) MIN NOM MAX UNIT VDD1 High-side supply voltage 4.5 5 5.5 V VDD2 Low-side supply voltage 2.7 5 5.5 V VVINP, VVINN Absolute input voltage GND1 – 0.32 VDD1 + 0.16 V VIN Differential input voltage VVINP – VVINN –250 250 mV VCM Common-mode input voltage (VVINP + VVIN) / 2 GND1 – 0.16 VDD1 V TA Operating ambient temperature –40 25 105 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 6.4 Thermal Information THERMAL METRIC(1) AMC1200-Q1 UNIT DUB (SOP) DWV (SOIC) 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 75.1 102.8 °C/W RθJC(top) Junction-to-case (top) thermal resistance 61.6 49.8 °C/W RθJB Junction-to-board thermal resistance 39.8 56.6 °C/W ψJT Junction-to-top characterization parameter 27.2 16 °C/W ψJB Junction-to-board characterization parameter 39.4 55.2 °C/W |
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