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IS67WVC4M16ALL Datasheet(PDF) 1 Page - Integrated Silicon Solution, Inc |
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IS67WVC4M16ALL Datasheet(HTML) 1 Page - Integrated Silicon Solution, Inc |
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1 / 67 page  IS66WVC4M16ALL IS67WVC4M16ALL 1 Rev. B | July 2012 www.issi.com – SRAM@issi.com Overview The IS66WVC4M16ALL is an integrated memory device containing 64Mbit Pseudo Static Random Access Memory using a self-refresh DRAM array organized as 4M words by 16 bits. The device includes several power saving modes : Reduced Array Refresh mode where data is retained in a portion of the array and Temperature Controlled Refresh. Both these modes reduce standby current drain. The device can be operated in a standard asynchronous mode and high performance burst mode. The die has separate power rails, VDDQ and VSSQ for the I/O to be run from a separate power supply from the device core. Single device supports asynchronous , page, and burst operation Mixed Mode supports asynchronous write and synchronous read operation Dual voltage rails for optional performance VDD 1.7V~1.95V, VDDQ 1.7V~1.95V Asynchronous mode read access : 70ns Interpage Read access : 70ns Intrapage Read access : 20ns Burst mode for Read and Write operation 4, 8, 16,32 or Continuous Low Power Consumption Asynchronous Operation < 25 mA Intrapage Read < 18mA Burst operation < 35 mA (@104Mhz) Standby < 180 uA (max.) Deep power-down (DPD) < 3uA (Typ) Low Power Feature Reduced Array Refresh Temperature Controlled Refresh Deep power-down (DPD) mode Operation Frequency up to 104Mhz Operating temperature Range Industrial: -40°C~85°C Automotive A1: -40°C~85°C Package: 54-ball VFBGA 64Mb Async/Page/Burst CellularRAM 1.5 Features Copyright © 2012 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances |
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